美国法案的芯片将加强美国半导体制造，创新
2020年6月10日星期三，下午4:58经过半导体工业协会
新的Bipartisan立法，在参议院介绍。Cornyn（R-Toxas），华纳（D-VA），Risch（R-Idaho），Sinema（D-Ariz）和Rubio（R-Fla）和in the House by Reps. Matsui (D-Calif.) and McCaul (R-Texas), would counter competing nations’ massive government incentives and strengthen U.S. economy, national security
华盛顿 - 6月10日，2020年 - 半导体行业协会（SIA）今天鼓掌在创造有用的激励措施中，为美国法案（美国筹码法案）制作半导体的介绍，将在半导体中投资数十亿美元的二数石manufacturing incentives and research initiatives over the next 5-10 years to strengthen and sustain American leadership in chip technology, which is essential to our country’s economy and national security. The bill was introduced today by Sens. John Cornyn (R-Texas), Mark Warner (D-Va.), Jim Risch (R-Idaho), Kyrsten Sinema (D-Ariz.), and Marco Rubio (R-Fla.) in the Senate, and a House version is slated to be introduced Thursday by Reps. Michael McCaul (R-Texas) and Doris Matsui (D-Calif.).
“Semiconductors were invented in America and U.S. companies still lead the world in chip technology today, but as a result of substantial government investments from global competitors, the U.S today accounts for only 12 percent of global semiconductor manufacturing capacity,” said Keith Jackson, President, CEO, and Director of ON Semiconductor and 2020 SIA chair. “The CHIPS for America Act would help our country rise to this challenge, invest in semiconductor manufacturing and research, and remain the world leader in chip technology, which is strategically important to our economy and national security. We applaud the bipartisan group of leaders in Congress for introducing this bill and urge Congress to pass bipartisan legislation that strengthens U.S. semiconductor manufacturing and research.”
美国目前维持稳定的芯片制造足迹，但趋势线涉及。有18个州的商业工厂，半导体等级作为我们国家的第五大出口。然而，其他国家的大量半导体制造激励措施已被置于其他国家，而美国半导体制造业生长滞后主要是由于缺乏联邦激励措施。
美国筹码法案包括一系列联邦投资，以推进美国半导体制造，其中包括100亿美元用于新的联邦赠款计划，该计划将激励新的国内半导体制造设施。该法案还包括可退还的投资税收抵免，用于购买新的半导体制造设备和其他设施投资。
研究对于推进美国半导体设计和制造公司的半导体创新至关重要。2019年投资于研发，近400亿美元的收入大约五分之一，代表了任何行业的第二高的研究投资率。然而，联邦政府对半导体研究的投资仅仅是美国总半导体研发的一小部分。并且在多年来的份额中相对平坦。与此同时，中国和其他人正在增加政府研究投资。
美国法案的芯片将在国防部，国家科学基金会和能源部门做出重大的联邦投资，以促进半导体研究和推动芯片技术突破。该法案将建立一个国家半导体技术中心，开展先进芯片的研究和原型，以及在先进的半导体包装中创建一个中心。需要这些投资来使美国公司能够在半导体材料，工艺技术，架构，设计和应用中保持其技术边缘。
“As global competitors invest big to attract advanced semiconductor manufacturing to their shores, the U.S. must get in the game and make our country a more competitive place to produce this strategically important technology,” said John Neuffer, President and CEO of the Semiconductor Industry Association. “We commend the bipartisan original cosponsors in both the Senate and House for their leadership in introducing this bold, timely legislation and urge Congress to move forward on a bipartisan basis to strengthen the bill and bolster domestic semiconductor manufacturing and research.”
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